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Uteco at Innovative Packaging Conference, Ningbo, China.

14.11.2016

The 2016 edition of the Conference on Innovative Packaging was held from November 1st to 4th in Ningbo, China: four days with different topics related to the future in the world of packaging. Among the most interesting topics we mention:

The promotion of innovative packaging as added value in the creation of more and more advanced products.

The promotion of ecological packaging to support the environmentally sustainable development

The study of smart solutions and technologies for packaging production

The encouragement of communication and the exchange of ideas between business

Uteco Group has participated at the event with a presentation made by Eng. Cucinella, Uteco Chief Marketing Manager, dedicated to the printing innovations for flexible packaging.

Specifically, the main topics were:

Printing, Coating, Laminating with Electron Beam,  carried out with the innovative Onyx XS EcoOne

Digital printing on flexible packaging with the introduction of the Sapphire and the Sapphire EVO

A remarkable audience attended the speech. In the afternoon Eng. Riccardo Camatta, Uteco Area Manager for the Far East, took part to the “Q&A Time”, responding to the relevant questions made by the experts.

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