On June 7th and 8th 2018 the first Latin Pack Fair took place in Santiago de Chile, creating a brand new meeting point for the packaging industry and the entire supply chain, starting from raw materials, processing machine producers for these materials and printing machines manufacturers such as Uteco Group up to the packaging producers.
In addition to the large participation during the two-day exhibition counting more than 5000 professionals and decision-makers of this sector with an important presence at the Uteco booth ( in collaboration with Packaging Xpert Agency) , many visitors took part in the dense seminar program sponsored by the Ministry of Finance and Industry of Chile according to the Decree 277, focused on the environment and innovation.
The speech of Mr. Alessandro Baldo – Uteco’s Latin America Sales Manager- "The new technologies in digital printing for flexible packaging", a must for the future of sustainable packaging and increasingly tailored to the customer, was really very followed.
The Innovations proposed by Uteco were welcomed with great enthusiasm and interest in one of the most competitive and dynamic countries in South America: Chile.
Digital printing, which Uteco already presented in world premire at Drupa 2016, LabelExpo 2017 and recently at the Print4All 2018 in Milan, will be the challenge for the next short-medium period to conquer an important share in the printing machines market dedicated not only to the Label Industry but also and especially to the whole packaging chain.